FIB-SEM

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Ion mill into a feature, then use ultra high-resolution SEM imaging to characterize the defect, or ion mill to prepare sample for lift-out. A FIB-SEM system uses a beam of Ga+ ion to mill into the surface to locate a feature or defect of interest. The integrated SEM then uses a focused beam of electrons to image the sample in the chamber. After identifying the location of a feature or defect, FIB-SEM is used to cross-section the defect with the FIB and examine it with the SEM. This allows sectioning step by step through the defect area and determining the layers affected by the defect. FIB-SEM produces data images at 0.8 nm spatial resolution. Global uses of FIB-SEM include production control, materials development, quality control, problem solving, failure analysis, reverse engineering, data storage, and optics.

NanoScale imaging using FIB-SEM

After identifying the location of a feature or defect, FIB-SEM is used to cross-section the defect with the FIB and examine it with the SEM. This allows sectioning step by step through the defect area and determining the layers affected by the defect. FIB-SEM produces data images at 0.8 nm spatial resolution. Global uses of FIB-SEM include production control, materials development, quality control, problem solving, failure analysis, reverse engineering, data storage, and optics.

Specification:

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Strengths and Advantages:

Routine Uses:

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Applications of FIB-SEM:

The Helios NanoLab 400 includes a five-axis stage with 100 mm of travel in X and Y. All-axis piezo drive and chamber mounting provide industry-leading stage repeatability. Samples up to 100 mm can be introduced through the load lock for optimal throughput. Larger samples may be accommodated (with limited travel) through the chamber door.